Signal isolation for module with ball grid array

ABSTRACT

Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.15/883,294, filed Jan. 30, 2018, entitled “SIGNAL ISOLATION FOR MODULEWITH BALL GRID ARRAY,” which claims priority to U.S. ProvisionalApplication No. 62/451,774, filed Jan. 30, 2017, entitled “SIGNALISOLATION FOR MODULE WITH BALL GRID ARRAY,” the disclosure of each ofwhich is hereby expressly incorporated by reference herein in itsrespective entirety.

BACKGROUND Field

The present disclosure relates to packaged radio-frequency (RF) modules.

Description of the Related Art

In many radio-frequency (RF) applications, one or more integratedcircuits are implemented in a packaged module. Such a packaged moduletypically includes a packaging substrate and one or more semiconductordie mounted on the packaging substrate. The packaged module can alsoinclude one or more surface-mount technology (SMT) devices having, forexample, respective passive circuit elements. Such SMT device(s) canalso be mounted on the packaging substrate.

SUMMARY

In accordance with a number of implementations, the present disclosurerelates to a packaged module that includes a packaging substrate havingan underside, and an arrangement of conductive features implemented onthe underside of the packaging substrate to allow the packaged module tobe capable of being mounted on a circuit board. The arrangement ofconductive features includes a signal feature implemented at a firstregion and configured for passing of a signal, and one or more shieldingfeatures placed at a selected location relative to the signal feature toprovide an enhanced isolation between the signal feature and a secondregion of the underside of the packaging substrate.

In some embodiments, the arrangement of conductive features can includean array of conductive pillars. In some embodiments, the arrangement ofconductive features can include a ball grid array.

In some embodiments, the one or more shielding features can include oneor more grounding features. In some embodiments, the one or moregrounding features can include a surface mounted component on theunderside of the packaging substrate and having a grounding path, or oneor more grounding solder balls.

In some embodiments, the packaged module can further include anunderside component mounted to the underside of the packaging substratein a volume defined by the ball grid array. The underside component caninclude, for example, a semiconductor die or a surface-mount technology(SMT) device.

In some embodiments, the packaged module can further include anupper-side component mounted to an upper side of the packagingsubstrate, such that the packaged module is a dual-sided module havingthe ball grid array. The underside component and the upper-sidecomponent can be parts of a radio-frequency circuit.

In some embodiments, the packaged module can further include an overmoldimplemented on the upper side of the packaging substrate. In someembodiments, the packaged module can further include a conformal shieldlayer implemented to cover an upper surface of the overmold and sidewalls defined by the overmold and the packaging substrate.

In some embodiments, the enhanced isolation associated with the signalfeature can be with respect to another signal feature implemented at thesecond region. In some embodiments, the enhanced isolation associatedwith the signal feature can be with respect to a component positioned atthe second region.

In some implementations, the present disclosure relates to a method formanufacturing a packaged module. The method includes forming orproviding a packaging substrate having an underside. The method furtherincludes arranging conductive features on the underside of the packagingsubstrate to allow the packaged module to be capable of being mounted ona circuit board. The arranging of conductive features includes forming asignal feature at a first region for passing of a signal, and formingone or more shielding features at a selected location relative to thesignal feature to provide an enhanced isolation between the signalfeature and a second region of the underside of the packaging substrate.

According to some teachings, the present disclosure relates to awireless device that includes circuit board configured to receive aplurality of modules, a transceiver implemented on the circuit board,and an antenna in communication with the transceiver and configured tofacilitate either or both of transmission and reception of respectivesignals. The wireless device further includes a radio-frequency modulemounted on the circuit board with an arrangement of conductive featuresbetween an underside of the radio-frequency module and the circuit boardsuch that at least a portion of the radio-frequency module iselectrically between the transceiver and the antenna. The arrangement ofconductive features includes a signal feature implemented at a firstregion of the underside of the radio-frequency module and configured forpassing of a signal, and one or more shielding features placed at aselected location relative to the signal feature to provide an enhancedisolation between the signal feature and a second region relative to theunderside of the radio-frequency module.

In some embodiments, the conductive features can be parts of theradio-frequency module. The conductive features can be arranged as, forexample, a ball grid array. The one or more grounding features caninclude one or more grounding solder balls.

In some embodiments, the second region relative to the underside of theradio-frequency module can include a region on the underside of theradio-frequency module that is laterally offset from the first region.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a side sectional view of a dual-sided module having aball grid array (BGA) on its underside.

FIG. 2 shows an example where the dual-sided BGA module of FIG. 1 ismounted on a circuit board.

FIG. 3 shows an underside of a module having a BGA with an array ofsolder balls, and two example components.

FIG. 4 shows an underside of a module having a BGA with an array ofsolder balls, and two example components, where one or more pins of theBGA are utilized to provide enhanced electromagnetic isolation betweendifferent regions of the underside of the module.

FIG. 5 shows another example of an underside of a module having a BGAwith an array of solder balls, and two example components, wheredifferent numbers and/or arrangements of pins of the BGA can be utilizedto provide enhanced electromagnetic isolation between different regionsof the underside of the module.

FIG. 6 shows yet another example of an underside of a module having aBGA with an array of solder balls, and two example components, where oneor more pins of the BGA can be utilized to provide enhancedelectromagnetic isolation between an outer pin of the BGA and anotherregion of the underside of the module.

FIG. 7 depicts a side sectional view of a module having a BGA havingselective placement of one or more ground solder balls to provideenhanced signal isolation, similar to the examples of Figures.

FIG. 8 shows a module that is similar to the example of FIG. 7, but inwhich pillars such as columns or posts can be utilized instead of solderballs.

FIG. 9 shows that in some embodiments, a grounding feature selected toprovide an enhanced signal isolation as described herein can be providedby a surface mounted component.

FIG. 10 shows an example of a radio-frequency (RF) module having one ormore features as described herein.

FIG. 11 shows an example of a wireless device having one or morefeatures as described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

FIG. 1 depicts a side sectional view of a dual-sided module 100 having aball grid array (BGA) on its underside. More particularly, the module100 includes a packaging substrate 102 with a radio-frequency (RF)circuit (collectively indicated as 104) implemented on its first side(e.g., upper side), and one or more components (collectively indicatedas 116) mounted on its second side (e.g., underside). The RF circuit 104on the upper side of the packaging substrate 102 can include, forexample, one or more semiconductor die, and/or one or more surface-mounttechnology (SMT) devices. The underside component(s) 116 can include,for example, one or more semiconductor die, and/or one or more SMTdevices.

In the example module 100 of FIG. 1, an overmold 106 is shown to beimplemented on the upper side of the packaging substrate 102 so as toencapsulate the RF circuit 104. Further, the upper surface of theovermold 106 and the side walls of the module 100 are shown to have aconductive layer 108 (e.g., a conformal conductive layer) that iselectrically connected to a ground plane 110 within the packagingsubstrate 102. Accordingly, the conductive layer 108 and the groundplane 110 generally define an internal volume, and provide RF shieldingfunctionality between the internal volume and external location(s). Insome embodiments, the module 100 may or may not include additionalshielding functionality (e.g., intra-module shielding between regionswithin the internal volume).

Although various examples are described herein in the context of moduleshaving such shielding functionalities (e.g., conformal shielding and/orintra-module shielding), one or more features of the present disclosurecan also be implemented in modules without such shieldingfunctionalities.

In the example of FIG. 1, the BGA is shown to include a plurality ofsolder balls 120 a, 120 b, 120. Such solder balls are shown to bearranged so as to provide an underside volume dimensioned to allowmounting of the underside component(s) 116. Such underside component(s)can be mounted to the underside of the packaging substrate 102 with orwithout an underfill.

Although various examples are described herein in the context of moduleshaving such a BGA with solder balls, one or more features of the presentdisclosure can also be implemented in modules with other conductivestructures. For example, pillars (e.g., columns, posts, etc.) can beutilized to provide functionalities similar to those of the solderballs.

Among others, additional details related to the foregoing dual-sidedmodule having a BGA can be found in U.S. Patent Application PublicationNo. 2016/0099192 entitled DUAL-SIDED RADIO-FREQUENCY PACKAGE HAVING BALLGRID ARRAY which is hereby expressly incorporated by reference herein inits entirety.

FIG. 2 shows an example where the dual-sided BGA module 100 of FIG. 1 ismounted on a circuit board 130 (e.g., a phone board). Such a circuitboard can be configured to include various electrical connections tofacilitate various functionalities of the module 100. For example, aground of the module 100 (e.g., at the ground plane 110) can beelectrically connected to a ground of the circuit board 130 (e.g., at aground plane 132) through an example solder ball 120 a. Such anelectrical connection is indicated as 134. In another example, anon-ground electrical connection can be made between the RF circuit 104of the module 100 and another location (e.g., another module) associatedwith the circuit board 130, through an example solder ball 120 b. Suchan electrical connection is indicated as 136.

In some embodiments, the non-ground electrical connection 136 canfacilitate, for example, power supply, control signal, and RF signalassociated with operation of the module 100. In some applications, asignal connection such as an RF signal connection can interfere withand/or be interfered by another part of the module 100. For example,FIG. 3 shows an underside of a module 50 having a BGA with an array ofsolder balls 120, and two example components 116 a, 116 b. In theexample shown, the outer perimeter of solder balls are utilized forgrounding purpose, and such ground solder balls or “pins” are indicatedas 140. The inner solder balls are utilized for non-grounding purpose,and such non-ground solder balls or pins are indicated as 142.

In the example of FIG. 3, suppose that some of the inner solder balls142 are utilized for routing signals. Passage of signals through suchsolder balls can impact or be impacted by one or more parts of themodule 50. For example, electromagnetic (EM) interference (depicted asarrow 152) is shown to be present or possible between two adjacentsolder balls. One of such solder balls is also shown to provideinterference to and/or be interfered by the first component 116 a(depicted as arrow 156) and another solder ball (depicted as arrow 150).Arrow 154 depicts another example of EM interference between a solderball and the first component 116 a. Arrow 158 depicts an EM interferencethat can exist between the first component 116 a and the secondcomponent 116 b. It will be understood that there can be more or lessinstances of EM interference than the examples shown in FIG. 3.

In the example of FIG. 3, the outer solder balls 140 being utilized asground pins can provide shielding between an interior region (generallydepicted as 144) and exterior locations. However, as described above,interference between various locations within the interior region 144are generally not addressed.

In some embodiments, a dual-sided BGA module such as the example ofFIGS. 1 and 2 can be configured to provide intra-module shielding amongtwo or more locations underneath the packaging substrate. Althoughvarious examples are described in the context of a dual sided module, itwill be understood that one or more features of the present disclosurecan also be implemented on the BGA side of a module even if that moduledoes not have any functional components on the other side of thepackaging substrate.

FIG. 4 shows an underside of a module 100 having a BGA with an array ofsolder balls, and two example components 116 a, 116 b. In the exampleshown, the outer perimeter of solder balls are utilized for groundingpurpose, and such ground solder balls or “pins” are indicated as 140.Accordingly, the outer solder balls 140 being utilized as ground pinscan provide shielding between an interior region (generally depicted as144) and exterior locations.

In the example of FIG. 4, some of the inner solder balls are utilizedfor non-grounding purpose, and such non-ground solder balls or pins canbe described as critical signal pins or non-critical pins. For thepurpose of description, a critical signal pin can be considered to be asignal pin for which enhanced isolation (e.g., electromagnetic isolationsuch as signal isolation) is desired. For the purpose of description, anon-critical pin can be a non-ground pin for which enhanced isolation isnot applicable or not needed.

In the example of FIG. 4, pins 160 a, 160 b, 160 c, 106 d (unfilledcircles) are assumed to be critical pins, and shaded circles 162 areassumed to be non-critical pins. In the example shown, suppose thatenhanced isolation is desired for each of the critical pins (160 a, 160b, 160 c, 106 d), as wells as part or all of each of the two components116 a, 116 b. To provide such enhanced isolation, one or more pins suchas ground pins (diamond fill pattern circles) can be provided relativeto a critical pin or a component.

For example, suppose that enhanced isolation is desired between the twocritical pins 160 a and 160 b. To achieve such an enhanced isolation,one or more of the ground pins indicated as 172 can be provided to begenerally between the two critical pins. Accordingly, EM interference(arrow 170) between the two critical pins 160 a and 160 b can be reducedor substantially eliminated (indicated by “X”) by some or all of theground pins 172. Similarly, suppose that enhanced isolation is desiredbetween the two critical pins 160 c and 160 d. To achieve such anenhanced isolation, one or more of the ground pins indicated as 190 canbe provided to be generally between the two critical pins. Accordingly,EM interference (arrow 188) between the two critical pins 160 c and 160d can be reduced or substantially eliminated (indicated by “X”) by someor all of the ground pins 190.

In another example, suppose that enhanced isolation is desired betweenthe critical pin 160 b and the first component 116 a. To achieve such anenhanced isolation, one or more of the ground pins indicated as 176 canbe provided to be generally between the two parts. Accordingly, EMinterference (arrow 174) between the critical pin 160 b and the firstcomponent 116 a can be reduced or substantially eliminated (indicated by“X”) by some or all of the ground pins 176. Similarly, suppose thatenhanced isolation is desired between the critical pin 160 c and thesecond component 116 b. To achieve such an enhanced isolation, one ormore of the ground pins indicated as 186 can be provided to be generallybetween the two parts. Accordingly, EM interference (arrow 182) betweenthe critical pin 160 c and the second component 116 b can be reduced orsubstantially eliminated (indicated by “X”) by some or all of the groundpins 186. Similarly, suppose that enhanced isolation is desired betweenthe critical pin 160 d and the second component 116 b. To achieve suchan enhanced isolation, one or more of the ground pins indicated as 186can be provided to be generally between the two parts. Accordingly, EMinterference (arrow 184) between the critical pin 160 d and the secondcomponent 116 b can be reduced or substantially eliminated (indicated by“X”) by some or all of the ground pins 186.

In yet another example, suppose that enhanced isolation is desiredbetween the first component 116 a and the second component 116 b. Toachieve such an enhanced isolation, one or more of the ground pinsindicated as 180 can be provided to be generally between the twocomponents. Accordingly, EM interference (arrow 178) between the firstand second components 116 a, 116 b can be reduced or substantiallyeliminated (indicated by “X”) by some or all of the ground pins 180.

In the various enhanced signal isolation examples of FIG. 4, each part(critical pins 160 a, 160 b, 160 c, 106 d, first component 116 a, orsecond component 116 b) of interest is shown to be generally surroundedby ground pins. In some embodiments, a part for which enhanced signalisolation is desired may or may not be fully surrounded by ground pins.For example, FIG. 5 shows an underside of a module 100 having a BGA withan array of solder balls, and two example components 116 a, 116 b. InFIG. 5, the critical pins 160 a, 160 b, 160 c, 106 d and the first andsecond components 116 a, 116 b are assumed to be parts of interest forwhich enhanced isolation is desired. Similar to FIG. 4, ground pins aredepicted as diamond pattern filled circles, non-critical pins aredepicted as shaded circles, and critical pins are depicted as unfilledcircles.

In the example of FIG. 5, however, each of the critical pins 160 a, 160b, 160 c, 106 d is not necessarily surrounded by ground pins. Forexample, to provide enhanced isolation (arrow 170 with an “X”) betweenthe critical pins 160 a and 160 b, placement of a single ground pin 191may be sufficient. Similarly, placement of a single ground pin 198 maybe sufficient to provide enhanced isolation (arrow 188 with an “X”)between the critical pins 160 c and 160 d. Similarly, placement of asingle pin (192, 196, or 197) may be sufficient to provide correspondingenhanced isolation (arrow 174, 182, or 184 with an “X”) betweenrespective parts.

In another example, to provide enhanced isolation (arrow 178 with an“X”) between the first and second components 116 a, 116 b, placement oftwo ground pins (193, 194) may be sufficient (instead of the examplefive pins 180 in FIG. 4).

In the examples of FIGS. 4 and 5, it is assumed that the outer pins arebeing utilized as ground pins. In some embodiments, some or all of theouter pins may be utilized as non-ground pins, and at least some of suchnon-ground pins may be critical pins for which enhanced isolation isdesired.

For example, FIG. 6 shows an underside of a module 100 having a BGA withan array of solder balls, and two example components 116 a, 116 b. InFIG. 6, critical pins 160 a and 160 b are shown to be positioned on theouter perimeter, and are assumed to be parts of interest for whichenhanced isolation is desired. Similar to FIGS. 4 and 5, ground pins aredepicted as diamond pattern filled circles, non-critical pins aredepicted as shaded circles, and critical pins are depicted as unfilledcircles.

In the example of FIG. 6, enhanced isolation between the two criticalpins 160 a, 160 b can be achieved by placement of a ground pin 200. Sucha ground pin may be sufficient to provide enhanced isolation (arrow 202with an “X”) between the critical pins 160 a and 160 b.

In some embodiments, and as described herein, enhanced isolation betweentwo underside parts of a module can be achieved by selective placementof ground pin(s) or solder ball(s). In situations where a plurality ofground pins are utilized for such purpose, the ground pins can be spacedappropriately so as to substantially block or significantly reduce theamount of interference between the two parts, even though the shieldingstructure is not a solid or continuous barrier.

FIG. 7 depicts a side sectional view of a module 100 having a BGA havingselective placement of one or more ground solder balls 175 to provideenhanced isolation for a critical signal pin 160, similar to theexamples of FIGS. 4-6. In some embodiments, similar isolationfunctionality can be implemented for modules having pillars instead ofsolder balls. For example, FIG. 8 shows a module 100 that is similar tothe example of FIG. 7, except that pillars (e.g., columns, posts, etc.)are utilized instead of solder balls. Thus, enhanced isolation can beprovided for a critical signal pillar 160 by one or more ground pillars175.

FIG. 9 shows that in some embodiments, a grounding feature selected toprovide an enhanced isolation for a critical signal pin can be providedby a surface mounted component 177. Such a component can be configuredto provide an electrical connection (179) between the lower surface ofthe component 177 and the ground plane 110 of the module 100. With sucha configuration, the component 177 can provide a ground contact at aselected location to thereby provide enhanced isolation as describedherein, when the module 100 is mounted on a circuit board (and the lowersurface of the component 177 is electrically connected to a ground planeof the circuit board). In some embodiments, such a component can be, forexample, a filter device such as a chip size SAW (surface acoustic wave)device (CSSD).

In some embodiments, a packaged module having one or more features canbe fabricated utilizing, for example, some or all of the manufacturingtechniques described in the above-referenced U.S. Patent ApplicationPublication No. 2016/0099192 entitled DUAL-SIDED RADIO-FREQUENCY PACKAGEHAVING BALL GRID ARRAY.

In some implementations, a packaged module having one or more featuresas described herein can be utilized in various products. For example,FIGS. 10 and 11 show examples of how a packaged module having one ormore features as described herein can be configured for use in awireless device, and/or be implemented in a wireless device. FIG. 10shows that in some embodiments, a packaged module having one or morefeatures as described herein can be implemented as a diversity receive(RX) module 100. In some applications, such a module can be implementedrelatively close to a diversity antenna 420 so as to minimize or reducelosses and/or noise in a signal path 422.

The diversity RX module 100 in the example of FIG. 10 can be configuredsuch that switches 410 and 412, as well as LNAs 414, are implemented ina semiconductor die (depicted as 104) that is mounted underneath apackaging substrate. One or more filters 400 can be mounted on such apackaging substrate as described herein.

As further shown in FIG. 10, RX signals processed by the diversity RXmodule 100 can be routed to a transceiver through a signal path 424. Inwireless applications where the signal path 424 is relatively long andlossy, the foregoing implementation of the diversity RX module 100 closeto the antenna 420 can provide a number of desirable features.

It will be understood that one or more features of the presentdisclosure can also be implemented in packaged modules havingfunctionalities different than that of the diversity receive example ofFIG. 10. For example, for any packaged BGA-based module where selectiveisolation (e.g., signal isolation) is desired on the underside, one ormore features as described herein can be implemented.

FIG. 11 shows that in some embodiment a packaged module having one ormore features as described herein can be implemented in a wirelessdevice 500. For example, an LNA or LNA-related module 100 can beimplemented as a packaged module as described herein, and such a modulecan be utilized with a main antenna 524.

The example LNA module 100 of FIG. 11 can include, for example, one ormore LNAs 104, a bias/logic circuit 432, and a band-selection switch430. Some or all of such circuits can be implemented in a semiconductordie that is mounted under a packaging substrate of the LNA module 100.In such an LNA module, some or all of duplexers 400 can be mounted onthe packaging substrate so as to form a packaged module having one ormore features as described herein.

FIG. 11 further depicts various features associated with the examplewireless device 500. Although not specifically shown in FIG. 11, adiversity RX module 100 of FIG. 10 can be included in the wirelessdevice 500 with the LNA module 100, in place of the LNA module 100, orany combination thereof. It will also be understood that a packagedmodule having one or more features as described herein can beimplemented in the wireless device 500 as a non-LNA module.

In the example wireless device 500, a power amplifier (PA) circuit 518having a plurality of PAs can provide an amplified RF signal to a switch430 (via duplexers 400), and the switch 430 can route the amplified RFsignal to an antenna 524. The PA circuit 518 can receive an unamplifiedRF signal from a transceiver 514 that can be configured and operated inknown manners.

The transceiver 514 can also be configured to process received signals.Such received signals can be routed to the LNA 104 from the antenna 524,through the duplexers 400. Various operations of the LNA 104 can befacilitated by the bias/logic circuit 432.

The transceiver 514 is shown to interact with a baseband sub-system 510that is configured to provide conversion between data and/or voicesignals suitable for a user and RF signals suitable for the transceiver514. The transceiver 514 is also shown to be connected to a powermanagement component 506 that is configured to manage power for theoperation of the wireless device 500. Such a power management componentcan also control operations of the baseband sub-system 510.

The baseband sub-system 510 is shown to be connected to a user interface502 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 510 can also beconnected to a memory 504 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

In various examples described herein, references are made to isolationfor an underside part of a packaged module, isolation between two ormore underside parts of a packaged module, etc. For the purpose ofdescription, it will be understood that such an isolation can includeisolation involving electromagnetic signal (e.g., RF signal beingprocessed), electromagnetic noise, or any combination thereof. For agiven part or region of a packaged module, such an isolation can reduceor eliminate impact of signal and/or noise resulting from anotherpart/region, reduce or eliminate impact of signal and/or noise onanother part/region if the signal and/or noise results from the givenpart, or any combination thereof. For the purpose of description, itwill be understood that such other part/region can be within thepackaged module or external to the packaged module.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A packaged module comprising: a packagingsubstrate having an underside; and an arrangement of conductive featuresimplemented on the underside of the packaging substrate to allow thepackaged module to be capable of being mounted on a circuit board, thearrangement of conductive features including a signal featureimplemented at a first region and configured for passing of a signal,and one or more shielding features placed at a selected locationrelative to the signal feature to provide an enhanced isolation betweenthe signal feature and a second region of the underside of the packagingsubstrate.